Fototapeta Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory, Computer Chip Manufacturing, Semiconductor Packaging Process. Generative AI.

Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory, Computer Chip Manufacturing, Semiconductor Packaging Process. Generative AI.

Numer zdjęcia: 724788375, autor: © visoot

Tytuł: Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory, Computer Chip Manufacturing, Semiconductor Packaging Process. Generative AI.

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