Fototapeta Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.

Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.

Numer zdjęcia: 575964549, autor: © IM Imagery

Tytuł: Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.

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