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Fototapeta In this close-up, silicon die are being removed from semiconductor wafers and attached to substrates by means of a pick-and-place machine. Part of the semiconductor packaging process.

In this close-up, silicon die are being removed from semiconductor wafers and attached to substrates by means of a pick-and-place machine. Part of the semiconductor packaging process.

Numer zdjęcia: 733936655, autor: © Zaleman

Tytuł: In this close-up, silicon die are being removed from semiconductor wafers and attached to substrates by means of a pick-and-place machine. Part of the semiconductor packaging process.

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